• Support Intel^® Core™ 2 Duo mobile processor Merom with Socket P @ 533/800 MHz FSB

• 1 x DDR2 SO-DIMM support up to 2.0 GB .

• Intel^® GME965 & ICH8M Chipset.

• Intel^® GME965 built-in GMA X3100 VGA , LVDS 

• SATA . USB 2.0 , Intel® Giga LAN

Board Size

125 x 95 mm .

CPU  Type

Support  Intel^® Core™ 2 Duo processor Merom with Socket P @ 800 MHz FSB .

Chipset

Intel^® GME965 & ICH8M . 

Memory Type

1 x DDR2 SO-DIMM support up to 2.0 GB .

VGA Interface

Intel^® GME965 Integrated GMA X3100 Technology . 

LVDS Interface

24-bit Dual channel LVDS interface .

Enhanced IDE

One UltraATA/100 IDE up to 2 ATAPI .

Series ATA

Integrated Series ATA controller facilities high-speed data transfer

up to 300MB/s for each of 3 ports .

LAN Interface

10/100/1000 Mbps Ethernet port provide by  Intel^® 82573 .

Audio

Intel^®  ICH8M HD Audio .

USB

Intel^® IC8M contains an EHCI and four UHCI controller support 8 x Hi-Speed USB2.0 ports .

PCI-Express Interface

1 x PCI-Express x16 interface

4 x PCI-Express x1 interface 

PCI Interface

Support 4 x external PCI bus interface .

CES- 471       Intel^® Core™ 2 Duo in Socket-P COM Express CPU Module with Intel^® GME965 chip

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